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ElectroMechanical Packaging Engineer IV

Lockheed Martin Corporation
FULL_TIME Remote ยท US Englewood, CO, US Posted: 2026-05-11 Until: 2026-06-10
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Job Description
Description: Join us at Lockheed Martin as an Electronics Packaging Engineer for the D5 Life Extension II program for avionics enclosure design and analysis. Location: This position does not support teleworking ;the selected candidate will be located near our Lockheed Martin Space facility in: Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time. Key activities you will accomplish in this role: Electronics packaging engineer for space flight applications, Geometric Dimensioning and Tolerancing (GD&T) and CREO and/or Pro-E CAD design. Create 3D solid models in CREO of space flight avionics and power hardware. Perform electronic packaging design and provide technical data for informal and formal Design Review documentation and presentations. Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems. Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance. Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment. Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed. To be effective in this role, you will need: Experience with the full product life cycle. Knowledge of the definition, interpretation, and implementation of design requirements. Coordination and execution of hardware designs. Development and integration of hardware for both custom and procured electronic assemblies in accordance with all Lockheed Martin Space engineering process spe