Job Description
Position Summary Serves as the primary manufacturing process engineer for the MK21A REM program at the Oxnard microelectronics facility. Owns the development, qualification, and production readiness of all GaN hybrid module assembly processes including eutectic die attach, wire/ribbon bonding, hermetic sealing, and substrate bonding. Performs PMP engineering functions per the program's Parts, Materials and Processes Control Plan (PMPCP). Drives NPI process development from first principles through production qualification. Responsibilities: Develop and qualify eutectic die attach (AuSn) processes for GaN-on-SiC power amplifier devices on CuW and silver-diamond carriers, including thermal profile optimization, void characterization, and scrub parameter development. Own the manufacturing process development lifecycle for electronic modules: die attach, substrate attach, gold and aluminum wire bonding, ribbon bonding, and hermetic lid sealing (laser weld and epoxy seal). Perform PMP engineering functions: evaluate and approve bonding processes, solder alloys, epoxies (RTV 3145, silver epoxy 84-1LMIT, Stycast, Arathane 5750), conformal coatings, and substrate treatments for nuclear-qualified flight hardware. Develop and optimize MNS (Metal Nitride Silicon) thin-film capacitor bonding profiles for the TX C35 RCCA corrective action implementation. Drive resolution of feed-through soldering process (currently at 75% reject rate) and other heritage process yield issues. Author and maintain work instructions, process flow documents, routers, and DVT/qualification test procedures for all Oxnard-built module types across hardware variants. Interface with design engineering to translate design intent into manufacturable processes. Bridge the gap between design engineering and the production floor. Support DCMA reviews of manufacturing readiness, including