Job Description
Are you looking to power the next leap in the exciting world of advanced electronics? Do you want to help solve problems that drive success in the rapidly evolving technology and connectivity landscape? Then bring your problem-solving, passion, and creativity to help us power the next leap in electronics. At Qnity , we're more than a global leader in materials and solutions for advanced electronics and high-tech industries - we're a tight-knit team that is motivated by new possibilities, and always up for a challenge. All our dedicated teams contribute to making cutting-edge technology possible. We value forward-thinking challengers, boundary-pushers, and diverse perspectives across all our departments, because we know we play a critical role in the world enabling faster progress for all. Learn how you can start or jumpstart your career with us. Position Overview Qnity Electronics has an exciting and challenging opportunity within Advanced Circuit & Packaging (ACP) for a Materials Scientist located in Marlborough, MA. This role focuses on materials and metallurgical innovation for advanced packaging interconnects, with strong emphasis on grain engineering for Cu-Cu bonding and intermetallic compound (IMC) behavior, barrier layer performance, and reliability of Cu / barrier / SnAg solder systems. The successful candidate will provide technical leadership in grain engineering, microstructure control, IMC suppression, and reliability characterization for next-generation metallization technologies supporting microbumps, Cu pillars, TSV, and hybrid bonding applications. Key Responsibilities Materials & Metallurgical Leadership Lead materials and metallurgical development for advanced packaging metallization, with focus on Cu, barrier layers, and SnAg solder interconnects. Establish structure-property-process relationships linking plating chemistry, deposition