Job Description
We are looking for an exceptional Principal PCBA (Printed Circuit Board Assembly) Manufacturing Engineer to lead the DFM (Design for Manufacturability) and DFT (Design for Testability) strategy throughout the entire NPI lifecycle, partnering closely with design engineering and global contract manufacturers to ensure every board is optimized for yield, test coverage, and factory readiness. This role will be responsible for driving schematic-level and layout-level reviews, identifying manufacturability and testability risks before they reach the factory, and influencing design teams toward architectures that scale cleanly into production. Success in this role requires deep expertise in PCBA processes and test methodologies, the ability to guide design teams with clarity and conviction, and the leadership to drive contract manufacturers toward disciplined, repeatable, high-quality execution. What you will do is: Collaborate with cross-functional teams (engineering, supply chain, operations) to ensure PCBA assemblies meet design and quality standards. Conduct Design for Manufacturability (DFM) and Design for Testability (DFT) reviews to ensure PCBA layouts are optimized for production, reducing costs and assembly time and ensuring high yields. Support global contract manufacturers with remote training, troubleshooting, and process optimization. Serve as the technical authority for SMT processes, including solder paste printing, SPI, pick-and-place, and reflow profiling. Lead ICT development and qualification of test fixtures, equipment, and software for production environments. Maintain revision control, documentation, and review supplier changes (PCNs, Gage R&R) for test processes. Analyze test data, drive root-cause analysis, and continuously improve test coverage, fault isolation, and throughput. Maintain a list of chemistries used at each PCBA supplier What