Job Description
Overview Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do. Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers. Responsibilities About the Job This critical position leads failure analysis, defect characterization, and root‑cause investigations for Keysight’s next‑generation hardware products. You will diagnose complex system, module, and component‑level failures; structure and drive disciplined RCA activities; and ensure timely, clear communication of findings through a weekly RCA dashboard and executive readouts. You will collaborate with design engineering, reliability, manufacturing, quality, and suppliers to systematically identify failure mechanisms, contain issues, and implement corrective and preventative actions. This is your opportunity to influence product quality, reliability, and architecture decisions across multiple product families. About The Team You will be part of Keysight Labs’ hardware development organization, partnering with multi‑discipline engineering teams across RF, photonics, digital, packaging, and manufacturing. The team values technical rigor, structured problem‑solving, and clear communication. Responsibilities RF Systems Design Support Support the architecture and definition of new products through all development phases of the RF/Microwave design ensuring that the product meets performance and manufacturability goals and reliability qualifications requirements Support development of novel RF/Microwave signal conditioning components in several different cutting-edge technology platforms, especially wrt identifying early the failure mechanisms in that design Develop new electromagnetic models to support fully characterizing complex subsystems, where simulation/emulation gaps exist Work with our internal and external manufacturing partners to troubleshoot prototype designs and bring them to volume production Failure Analysis & Root Cause Leadership Lead end‑to‑end failure analysis investigations for systemic, intermittent, and NPI‑related hardware failures Develop structured problem‑solving plans (5 Whys, Ishikawa, fault‑tree analysis, DOE-based isolation, etc.) Own the weekly RCA dashboard summarizing investigation status, findings, risks, and next steps for leadership Drive cross-functional review sessions, ensuring alignment on problem statements, data requirements, and closure criteria Technical Investigation & Troubleshooting Reproduce, isolate, and characterize failures in collaboration with product designers and test engineering Interpret complex data sets, test results, and statistical patterns to identify failure mechanisms Document clear, data‑driven root‑cause conclusions and recommended corrective actions Cross‑Functional Collaboration Partner with design, reliability, manufacturing, and supplier teams to validate findings and ensure robust corrective actions Provide feedback to design teams on systemic trends, design margins, and reliability opportunities Support design verification, environmental stress tests, and reliability qualification review as needed Qualifications Core Qualifications BS, MS, or PhD in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field Strong understanding of electronics fundamentals, hardware system behavior, and failure mechanisms Experience working with RF, high‑speed digital, photonics, power electronics, and/or mixed‑signal hardware systems Demonstrated proficiency with troubleshooting tools (oscilloscopes, VNAs, logic analyzers, curve tracers, thermal imaging, etc.) Experience with structured problem‑solving methodologies (5 Whys, FMEA, 8D, DOE) Excellent communication skills with the ability to distill complex technical content into concise status updates and dashboards Highly organized and effective at managing multiple parallel investigations Strong c